Our LabSpin6 systems are suitable for round substrates up to 150 mm diameter or square substrates up to 100x100 mm. With a wide range of substrate holders, even fragments and special shapes can be processed without any problems. Them allows a very wide range of applications.
Suitables for:
- Spin coating, the process of evenly coating a spinning substrate with a solution. The solution, for instance, a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film. Spin coating is limited in use to structures without high topography.
Puddle developing, it involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.
Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.Spray developing, it perform the developing as describe in the Puddle developing section, but with a constant flux of developer medium to prevent the agent saturation.
