HB10 Thermosonic Wire Bonder for Wedge & Ball Bonding

The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot
and small scale production lines. With One Bond Head for bonding in
Ball/Wedge or Wedge/Wedge bonding mode is capable to perform
semi-automatized bondings where the position is chose by the operator.
Bonding tool change is fast and the only operation needed to change the
bonding mode. Thus, is is easy to meet your needings in case.

The system is complete with a 100x100 mm Heater stage with Pick & Place.
In house are present:
Gold wire of 25 μm diameter and Aluminium wire of 25 μm diameter.
Gold Ribbon of 25x250 μm size

Technical Specifications:
Ultrasonic system, 63,3 kHz Transducer PLL Control;
Utrasonic power, 0-10Watt Output;
Bond  time, 0-20000 ms;
Bond force, 5-150cN;
Motorized Z travel, 17mm (0,67”) 1μm incremental steps;
Fine Table motion, 10mm (0,39“);
Temperature controller up to 250°C+/-1°C